Ion Beam Treatment Sputter

Details

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• Ion Beam Treatment Sputter system is designed for homogeneous film coating up to
  350 mm substrates. The system is extensively used for the deposition with a wide range
  of materials such as insulators, metals, and semiconductors.
  Two magnetron cathodes can be used in a system for multilayer deposition of each different material or co-deposition.

  Specification	Linear anode ion source (attach the loadlock chamber) Uniformity : ≤ 3% (at 350 mm zone) Base pressure : - Process Chamber ≤ 1 x 10-7 torr - Loadlock chamber ≤ 1 x 10-6 torr PEM (Plasma Monitoring System) : optional part Software interfaces : HMI programing base GUI software
  Application	Metal & oxide films deposition Thin-film transistors Research & development Simply ion beam cleaning