Ion Beam Treatment Sputter system is designed for homogeneous film coating up to 350 mm substrates. The system is extensively used for the deposition with a wide range of materials such as insulators, metals, and semiconductors. Two magnetron cathodes can be used in a system for multilayer deposition of each different material or co-deposition.
Linear anode ion source (attach the loadlock chamber) Uniformity : ≤ 3% (at 350 mm zone) Base pressure : - Process Chamber ≤ 1 x 10-7 torr - Loadlock chamber ≤ 1 x 10-6 torr PEM (Plasma Monitoring System) : optional part Software interfaces : HMI programing base GUI software
Metal & oxide films deposition Thin-film transistors Research & development Simply ion beam cleaning