Cluster Sputter System

Details

• 카달로그 다운로드

• Cluster Sputter System is designed for homogeneous film coating up to 200 mm substrates. This sputter system consists of the various process module for combinatorial deposition
  by a customer's needs. And this system can be used in optimized process for step coverage of trench and filling of via/through hole.

  Specification

  Configuration : Transfer system : 6 ~ 8 side transfer module Process module : max 4 process module Loading/unloading module : 25 slot cassette 2 module Wafer aligner & degassing module Sputter cathode : max 4 cathode per 1 process module Sample size : 3 ~ 8inch (75mm ~ 200mm) Transfer robot : Vacuum transfer robot (double pick-up) Base Pressure : - Process Chamber ≤ 1 x 10-7 torr - Transfer Chamber ≤ 1 x 10-6 torr Software interfaces : HMI programing base GUI software

  Application

  Power Device Multi-layer process Memory MRAM & Magnetic device Material research & development